The key technology system for achieving nanoscale precision in semiconductor components covers three dimensions: material control, process optimization, and detection verification: 1、 Material preparation and pretreatment Wafer thinning control The original thickness of a 12 inch wafer is 775 μ m, and thinning requires the use of temporary bonding/debonding technology to achieve ultra-thin processing below 20 μ m, with thickness variation controlled within<1 μ m. SiC substrate requirements: Si surface roughness Ra ≤ 0.3nm, C surface Ra ≤ 0.5nm, using a combination of mechanical initial polishing and chemical mechanical precision polishing process. Material stability optimization Perform

一、 Precision machining process control 1. Optimization of cutting parameters Turning/milling: The precision turning accuracy can reach IT5 level (tolerance ≤ 0.01mm), and it is necessary to control the spindle radial runout ≤ 0.005mm and feed rate ≤ 0.05mm/r. Stainless steel precision machining needs to be divided into three processes: coarse, medium, and fine. The residual gradient should be controlled at 0.2mm → 0.05mm → 0.01mm to avoid rough cutting marks. Grinding: The linear speed of the grinding wheel is ≥ 35m/s, the feed rate of the workpiece is ≤ 0.5m/min, and the surface roughness can

1、 Technical equipment advantages: Intelligent CNC cluster: equipped with 20 Japanese Mazak five axis linkage CNC machines, with a machining accuracy of ± 0.005mm. Special process capability: Possess special processes such as deep hole drilling (L/D ratio 20:1) and mirror polishing (Ra0.2 μ m). Testing system: Dual quality inspection guarantee of three coordinate measuring instrument and spectral analyzer. 2、 Material handling expertise: Covering 12 materials including 304/316 stainless steel and alloy steel. The independent heat treatment workshop can achieve modification treatments such as quenching (HRC58-62) and nitriding. Experience in large-scale processing of over 5000 tons of

一、 Industry positioning and technological strength 1. Precision manufacturing benchmark enterprise: With 15 years of focus on aluminum alloy component processing in the aviation/automotive/electronic fields, we have introduced German CNC five axis machining centers (accuracy ± 0.01mm). Passed AS9100D aerospace quality management system certification. 2. Advantages of full process technology: raw material testing, CNC precision cutting, surface anodizing treatment, 3D laser detection. 二、 Core competitive advantage 1. Cost control system: adopting AI scheduling system to reduce energy consumption by 15%, and strategically cooperating with aluminum suppliers to ensure stable raw material prices. 2. Special technological breakthroughs:

The parts processed by Sumitech will pass through the precision testing system developed by the company to ensure that each part is qualified and delivered to the customer.Our precision detection system:Coordinate Measuring Machine (CMM)Applicable scenarios: Complex surfaces, hole accuracy detection (positioning accuracy ± 1.5 μ m)Key operation: Measure in the constant temperature workshop (23 ± 0.5 ℃) to avoid the influence of thermal deformation.Laser scanning measurementAdvantages: Non contact and fast acquisition of 3D point cloud data, suitable for deformation analysis of thin-walled parts.Special measuring tool testingConventional size: Use a digital caliper/micrometer (resolution 0.001mm).Special structures: Targeted fixtures

Material characteristics High strength and low density: twice the hardness of steel but 40% lighter in weight, requiring high-power equipment Poor thermal conductivity: The cutting area is prone to accumulating high temperatures (up to 1000 ℃) and requires forced cooling High chemical activity: prone to chemical reactions with tool coatings above 600 ℃ Key process requirements Tool selection: Recommended diamond/cubic boron nitride coating, front angle ≤ 15 ° Parameter optimization: cutting speed controlled at 30-60m/min, feed rate 0.1mm/r Cooling plan: Water based emulsion must be used with a flow rate of ≥ 20L/min Processing precautions: safety

1. In the aerospace field, sumitech CNC precision machining technology can manufacture high-precision and high reliability components. The turbine blades of aircraft engines require extremely high precision and performance. We can accurately process complex surfaces and high precision holes through multi axis linkage technology, meeting the strict requirements of aviation components and ensuring the safety and reliability of aircraft. 2. The automotive manufacturing industry is also an area where our CNC precision machining excels. For example, the precision of components such as crankshafts, pistons, and cylinder blocks inside automobile engines directly affects the performance and reliability

The commonly used materials for precision machining in Sumitech factory include: Stainless steel series (316/316L/316F/303/304/420, etc.)Aluminum alloy series (AL6061/5083/7075/2A12, etc.)Alloy series (Invar alloy, cobalt nickel alloy, 718, etc.)Engineering plastics series (PEEK/POM/ABS/PTFE, etc.)Fiberglass series (G10/FR4, etc.)Carbon fiber seriesCopper series (C1100/black copper, brass, tin bronze, etc.) The above materials are all proficient and experienced parts of Sumitech factory, which can select different cutting tools and create different processing programs according to different materials. The main processing objects are box type parts, complex surfaces, irregular parts, and composite plate type parts. 3. Alien partsAlien parts are irregular components that

Sumitech’s automated precision parts machining process typically includes key steps such as design planning, material preparation, precision machining, inspection and quality control, surface treatment, and assembly and commissioning. Firstly, design planning is the starting point for automated precision machining of parts. Engineers use computer-aided design (CAD) software to create precise part drawings that detail the dimensions, shape, materials, and other key elements of the parts, providing clear guidance for subsequent machining steps. Next, the material preparation stage involves selecting suitable raw materials according to design requirements and conducting necessary preprocessing such as cutting, polishing, etc. to