
Precision machining technology for semiconductor components
Sumitech’s precision machining process for semiconductor components mainly includes technical principles, process flow, and key processing technologies. Firstly, from a technical perspective, the core of precision machining of semiconductor components lies in achieving size control and surface quality optimization at the micrometer or even nanometer level. This requires strict control of parameters such as temperature, pressure, and cutting force during the machining process to ensure that the machining accuracy and surface roughness meet the design requirements. At the same time, semiconductor materials such as silicon and gallium arsenide have unique physical and chemical properties, which also